Sep 5, 2014

[[Optical Component]] Wafer scale packaging platform for transceivers

A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon...



source Optical Component patent applications http://ift.tt/1CwTsfn

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