A method for mounting components on a substrate includes receiving a component with a suction member which is mounted on a bonding head, displacing the bonding head relative to the substrate by means of a first movement axis and a second movement axis in order to position the component in a...
source Optical Component patent applications http://ift.tt/1t0WAeo
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source Optical Component patent applications http://ift.tt/1t0WAeo
via
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