Methodologies enabling integration of optical components in ICs and a resulting device are disclosed. Embodiments include: providing a first substrate layer of an IC separated from a second substrate level by an insulator layer; providing a transistor on the second substrate layer; and providing an optical component on the first substrate...
source Optical Component patent applications http://www.freshpatents.com/-dt20141225ptan20140374915.php
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source Optical Component patent applications http://www.freshpatents.com/-dt20141225ptan20140374915.php
via
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