Jan 2, 2014

[[Optical Component]] Electro-optical assembly fabrication

A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a...



source Optical Component patent applications http://www.freshpatents.com/-dt20130321ptan20130067715.php

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